BGA

1. Surface Mouted Technology (SMT)
2. Through Hole Technology (THT)
3. Profiling: Punching, Routing, V-cut, Beveling
4. Material based: CME1, CME3, FR4, High TG FR4, Halogen-free FR4, Aluminium, Ceramic, PTFE(F4B, F4BK), Rogers(4003, 4350, 5880), Taconic, Arlon(35N, 85N), etc.
5. Min.hole ring: 0.075mm
6. Hole position/Tolerance: ±0.05mm / ±0.076mm
7. Special requirements: Buried & Blind vias + Controlled impedance + BGA
8. Certificate: UL, ISO9001
BGA